Anti-Counterfeit/Authentication Capabilities
Decapsulation
Provides visual die verification and
confirms MFG and markings
X-RAY
Validates lead frame and wire bond integrity
Resistance to solvents
Utilization of Dynasolve, Acetone, and scrape testing to confirm mark permanency
Visual inspection
Verification of marking, condition, and physical dimension
XRF/ROHS
Verifies material content conforms to MFG specifications